MG Chemicals non-silicone heat transfer compound. Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application. High efficient thermal conductive properties means more rapid transfer of heat for longer component life. High temperature stability - provides physical properties of low bleed and low evaporation for long-term service in any application that requires Heat Sink Compound. Uses synthetic fluids and metal oxide fillers - provides excellent conductive properties that exceed those of other heat sink formulas. Will not dry, harden, melt or migrate in any heat sink application. Compatible with metal and plastic components. No migration and component contamination. Typically, Heat Transfer Compounds (heat sink compounds) are used in OEM Electronic Component Plants to insure fast, accurate heat transfer in electronic components and circuitry. Other uses: semiconductor mounting devices thermal joints; ballast heat transfer mediums; power resistor mountings; thermocouple wells; transistor diodes and silicone rectifier base and mounting studs; all electric and electronic devices where efficient heat transfer cooling through thermal coupling is required. Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application High efficient thermal conductive properties High temperature stability Uses synthetic fluids and metal oxide fillers Will not dry, harden, melt or migrate in any heat sink application Item Weight 3.52 ounces Manufacturer MG Chemicals Item model number 8610-1P Package Dimensions 3.9 x 3.7 x 3.6 inches