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India's semiconductor push gets major boost with $3.3 bn Odisha deal with Intel & 3D Glass Solutions - The Economic Times

Odisha, Intel and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. This project, with an investment of $3.3 billion, will be located in the Bhubaneswar-Khurda region. The facility will produce advanced semiconductor components.

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